The EU and Japan are collaborating internationally on semiconductors. The buyer for this collaboration is not specified. This collaboration falls under an uncategorised category.
Expected Outcome: Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry. Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.
Reproduced verbatim from the official notice — only the wording is the source's; we split it into sections for readability.
A curated shortlist scored against what your company actually does — in your inbox every Monday, 06:45. Reply to ask anything; answers in 15–30 minutes, with sources.